KIWO LX LTS/CTS Series
KIWO LX LTS/CTS Series
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Description
The LWG Difference
Features
Specifications Table
| APPLICATION | Textile, Decal, Label, Decoration, Packaging, PCB, etc. |
|---|---|
| Imaging System | DMD DLP Technology (Laser Powered) |
| Emulsion Thickness (EOM) | Solvent resistant emulsion 3μm - 150μm, water resistant emulsion 2μm - 220μm |
| Exposure Time | 120 - 240s/ m², #350 yellow mesh |
| Resolution | 1270/2540 dpi (optional) |
| Raster | Up to 120LPI |
| Focus System | Automatic focusing |
| File Format | 1-bit .tif |
| Laser Type | UV laser, wavelength 405±5nm |
| Laser Power | 20W/25W (optional) |
| Recommended Conditions | Yellow light room with dust free conditions, temperature 65 - 75 ±2°F, 40-70% relative humidity (no condensation) |
| Power | Single phase 110v/220v, 50/60HZ, 3KW, air 1L/min |
Comparison Table
| FEATURE | KIWO LX LTS/CTS Series | Traditional Film & Vacuum Frame |
|---|---|---|
| Imaging Precision | Up to 2540 DPI with 50-micron line detail | Limited by film output resolution and vacuum contact |
| Consumable Costs | Zero film positive or chemical developer expenses | Ongoing costs for film, ink, and chemistry |
| Setup Speed | Direct digital transfer instantly exposes screens | Requires manual film alignment, taping, and vacuum setup |
| Curing Efficiency | High-energy 405nm lasers cure thick EOM and diazo emulsions | Requires long UV bulb exposure times |